Smart Robot Blade/Fork

Since the semiconductor manufacturing process is highly automated, it depends on the robotic arm to complete the moving operations once the wafer is inserted into the machinery. In order to improve the stability of the robotic arm and achieve real-time detection of wafer damage, collision interference and other sporadic abnormalities, it is customarily necessary to install sensors on the equipment or robotic arm for long-term monitoring in order to determine the current production status or anomaly reports.
 

Microprogram exclusively designed Smart Robot Blade/Fork with our partners. The sensor is integrated into the blade/fork with a unique and patented design, which is more sensitive than an external sensor and can detect the motion of a robot or wafer. The blade's exterior size is unaffected, the sensors are concealed and simultaneous online measurement is supported to achieve real-time equipment abnormality monitoring. In addition, it offers a number of services, including data collection, data uploading, feature calculation and analysis software, learning algorithms to aid operators in accurately understanding vibration data, immediately identifying failure points and effectively enhancing the process yield and machine utilization.